Vishay launches an industry first for standard gate drives…

From 12th August 2019 Vishay Intertechnology have launched a new 60 V MOSFET which increases efficiency and power density with RDS(ON) of 4 mΩ in 3.3 mm2 Footprint. The Vishay Siliconix SiSS22DN features a low gate charge of 22.5 nC along with low output charge (QOSS).

Unlike logic-level 60 V devices, the typical VGS(th) and Miller plateau voltage of the SiSS22DN are enhanced for circuits with gate drive voltages above 6 V, where the device provides optimized dynamic characteristics that enable short dead-times and prevent shoot-through in synchronous rectifier applications. To read the full press release, click here.

Introducing 150°C, 0402 size chip ferrite bead for automotive use

Murata Manufacturing Co., Ltd. has introduced the BLM15HG_BH series of 0402 size (1.0×0.5mm) chip ferrite bead with guaranteed temperature use at 150°C for automotive powertrain safety applications. This product is scheduled to start mass production in October 2017.

There has formerly been a guaranteed 125°C usage temperature product on the automotive market for noise suppression in the vicinity of mounted sensors, but the current product attains the 150°C guaranteed temperature usage needed by customers for high temperature applications. The use of a guaranteed 150°C product eliminates the need to avoid high temperature areas when installing, thereby granting greater freedom of design.

The BLM15EG_BH series has large impedance up to high frequency (vicinity of 1GHz), making it suitable for noise suppression over a wide frequency range.

Murata has already introduced a 150°C guaranteed temperature usage chip ferrite bead, which can be solder mounted, in the 0603 size (1.6×0.8mm) and 0805 size (2.0×1.25mm). Adding the 0402 size to the product lineup for the same series of 150°C guaranteed temperature usage chips contributes to space saving.

Automotive MCUs for High-speed Networking in Instrument Clusters

Cypress Semiconductor Corp. yesterday announced it is sampling new devices in its Traveo™ automotive microcontroller (MCU) family that provides secure, high-speed networking for classic instrument cluster applications. The new MCUs support the Controller Area Network Flexible Data-rate (CAN FD) standard for high-speed, in-vehicle networking, allowing large amounts of data to be exchanged between each CAN node. Integrated enhanced Secure Hardware Extension (eSHE) support enables the devices to secure data on in-vehicle networks and prevent unauthorized connections to electronic control units (ECUs). The new MCUs offer advanced system features, high-quality sound and graphics, and can drive up to six traditional mechanical gauges, adding to the scalability of Cypress' market-leading Traveo family.

"Our newest 40nm MCUs add to the industry-leading scalability of the Traveo platform for instrument clusters, giving automotive customers options for simple displays in mass-market vehicles up to our MCUs for advanced 3D color graphics in luxury vehicles," said Takeshi Fuse, senior vice president of the Automotive Business Unit at Cypress. "These new offerings open up cost-effective implementations with high-performance and advanced features to classic instrument cluster applications, including support for CAN FD and eSHE to address industry demand for high-speed in-vehicle networking with advanced security".

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Taoglas Launches Axiom Reference Design for Connected Vehicles

Taoglas announced the launch of Axiom, a reference design for a low-profile, compact multiple-antenna solution for the next generation of Connected Cars. The reference design will help automobile manufacturers overcome one of the biggest challenges of the Connected Car: where and how to place the multitude of antennas needed for maximum performance.

As many as 18 antennas are needed to power the next-generation Connected Car. This includes multiple cellular antennas for network connectivity; Wi-Fi for hotspot connectivity; GNSS for navigation, emergency call systems and other location-based technologies; satellite radio; AM/FM antennas; radar antennas for object detection; Bluetooth antennas for smartphones and other devices, and dedicated short-range communications (DSRC) antennas for vehicle-to-vehicle/infrastructure applications.

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Murata introduces 1210-size common mode choke coils for automotive CAN I/F

Murata Manufacturing Co., Ltd., will be commercially producing the DLW32SH_XK series of 1210 inch size (3.2 x 2.5 mm) common mode choke coils capable of withstanding operating temperatures up to 125°C for the on-board control system interface CAN (Controller Area Network). Mass production of this product is scheduled to begin in July.

Automobiles contain multiple electronic control units (ECU), and these ECUs exchange data with each other by means of the differential interface (CAN) for automobile control.

Currently, 1812 inch size (4.5 x 3.2 mm) common mode choke coils, such as the DLW43SH series, are used for CAN.

However, because the shift toward automatic driving is gaining speed and the number of on-board ECUs has been increasing every year, compact products are in demand in the market.

This is why Murata will be commercially producing the DLW32SH_XK series of 1210 inch size (3.2 x 2.5 mm) common mode choke coils based on the winding technology it has cultivated in the common mode choke coil DLW43SH series for CAN/Flex Ray.

Lantronix Joins the Industrial Internet Consortium to Accelerate Adoption of the Internet of Things

Lantronix announced that it has joined the Industrial Internet Consortium® (IIC), the world’s leading organization in transforming business and society by accelerating the Industrial Internet of Things (IIoT).

The research and advisory firm, Gartner, estimates the installed base of the IoT will exceed 20 billion units worldwide by 2020, with the McKinsey Global Institute estimating the economic potential of IoT to be as much as $11.1 trillion by 2025. This massive economic opportunity can only be realized if companies small and large can develop a new generation of technology solutions that will help them manage, operate, and service, connected products securely. In addition, these companies need a platform to help them rapidly create web-scale business applications that fully leverage a smart and connected world.

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