New Solution Combines Cypress’s HyperFlash™ and HyperRAM™ Memories Based on the High-Bandwidth, Low-Pin-Count HyperBus™ Interface

Cypress Semiconductor Corp. announced the qualification of a small-footprint memory solution that enables instant-on applications. The solution contains Cypress’s 3V 512-Mbit HyperFlash™ and 64-Mbit HyperRAM™ memories in a multi-chip package (MCP) measuring only 8-mm by 6-mm. The Cypress HyperFlash and HyperRAM MCP combines a high-speed NOR flash memory for fast-boot, instant-on capability with a self-refresh DRAM for expanded scratchpad memory in a low-pin-count package for space-constrained and cost-optimized embedded designs. The solution is ideal for a wide range of applications, including automotive clusters and infotainment systems, communication equipment, industrial systems and high-performance consumer products.

The HyperFlash and HyperRAM MCP leverages Cypress’s 12-pin HyperBus™ interface and is housed in a 24-ball ball grid array (BGA) package that shares a common footprint with both discrete HyperFlash and HyperRAM products. This common footprint enables design engineers to implement a single-pad layout that supports either discrete device or the HyperFlash and HyperRAM MCP, allowing changes at any point in the design or product lifecycle without affecting board layout. This flexibility enables differentiated end products based on a single platform design, saving development time and minimizing cost.

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We are pleased to announce that our company will participate in the exhibition Electronica 2016, among other 2913 exhibitors from 50 countries.

We are waiting for you November 08-11 in Munich at the stand 107 (Hall B5).

Come and see cutting edge products that contribute to the future of smart living. Sensors, wireless communication modules and power solutions for smart homes, lighting, automotive and healthcare purposes will be showcasing.

Taoglas USA, Inc, the leading provider of antenna solutions to the M2M and connected device market, is first to provide an entire product line that contains an antenna diagnostic compatibility feature within its cellular antennas for M2M devices. Called AntD©, this solution enables M2M device manufacturers to detect if an antenna is connected or not and informs device owners if an antenna or transmission line has been damaged or is no longer working.  This is critical for M2M devices in remote areas, devices in danger of being vandalized or for customer-care, trouble-shooting situations.

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Cypress Semiconductor Corp. announced a new addition to its Traveo™ automotive microcontroller family with more memory for program code and graphics to support hybrid instrument cluster applications. The new, highly integrated devices in the S6J32xE series provide a single-chip solution that can drive graphics on head-up displays or traditional gauges, but also provides scalability with Cypress’s low-pin-count HyperBus™ memory interface. The addition continues Cypress’s expansion of its broad automotive portfolio that delivers differentiating performance via its MCUs, memories, wireless radios, capacitive-touch solutions, Power Management ICs (PMICs) and other technologies.

The Traveo S6J32xE series features up to 4MB of high-density embedded flash, 512 KB RAM and 2 MB of Video RAM, along with an ARM® Cortex®-R5 core at 240 MHz performance. The MCUs have up to two 12-pin HyperBus memory interfaces that dramatically improve read and write performance of graphical data and other data or code. The devices can use a single HyperBus interface to connect to two memories for Firmware Over-The-Air (FOTA) updates, which enable end-users to get new software fixes, features and applications for their vehicles on-the-go. The series includes a Low-voltage Differential Signaling (LVDS) video output, providing a suitable interface to attach external displays such as Thin-Film-Transistors (TFTs). The MCUs support all in-vehicle networking standards required for instrument clusters, including Controller Area Network-Flexible Data (CAN-FD) and Ethernet AVB.

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Fujitsu Semiconductor Ltd. announced the development of MB85RQ4ML, its new FRAM product with 4 Mbit of memory, which represents the highest density in the non-volatile RAM market with a quad SPI interface, and has the highest data transfer rate in Fujitsu's FRAM product line. The new product is available in sample quantities starting today.

Its high-speed operation and non-volatile memory make it ideal for use in the networking, RAID controller, and industrial computing fields.

Leveraging FRAM's non-volatility, high-speed read/write cycles, high read/write endurance, and low power consumption, Fujitsu Semiconductor has been proposing batteryless solutions using FRAM for the wearables market and the IoT market.

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